Technical Details

• Package / Case 256-BGA
• Mounting Type Surface Mount
• Interface CAN, EBI/EMI, I2C, McBSP, SCI, SPI
• Type Floating Point
• Operating Temperature -40°C ~ 105°C (TJ)
• Non-Volatile Memory ROM (16kB)
• On-Chip RAM 260kB
• Voltage - I/O 3.30V
• Voltage - Core 1.10V
• Clock Rate 200MHz
• Supplier Device Package 256-BGA (17x17)