Technical Details

• Package / Case 780-BBGA, FCBGA
• Speed 1.5GHz
• RAM Size 256KB
• Number of I/O 360
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Primary Attributes FPGA - 270K Logic Elements
• Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA, POR, WDT
• Supplier Device Package 780-FBGA, FC (29x29)
• Architecture MCU, FPGA
• ECCN 5A002A1
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS Compliant