Technical Details

• Package / Case 205-TFBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, HPI, McBSP
• Type Fixed Point
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory ROM (32kB)
• On-Chip RAM 320kB
• Voltage - I/O 3.30V
• Voltage - Core 1.60V
• Clock Rate 200MHz
• Supplier Device Package 205-BGA MICROSTAR (10x10)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant