Technical Details

• Package / Case 525-FBGA, FCBGA
• Mounting Type Surface Mount
• Speed 400MHz, 1.3GHz
• Operating Temperature -40°C ~ 105°C (TA)
• Core Processor ARM® Cortex®-A53, ARM® Cortex®-M7
• Voltage - I/O 1.8V, 3.3V
• Supplier Device Package 525-FCPBGA (19x19)
• Ethernet 2.5Gbps (3)
• USB USB 2.0 OTG (1)
• Number of Cores/Bus Width 3 Core, 64-Bit/8 Core, 32-Bit
• Co-Processors/DSP Multimedia; NEON
• RAM Controllers DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration No
• Security Features ARM TZ, Cryptography, Random Number Generator, Secure Fusebox, Secure Memory, XRDC
• Additional Interfaces CANbus, DMA, FlexRay, I2C, LINbus, eMMC/SD, PCIe, SPI, UART
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant