• In Stock 1675

Technical Details

  • Package / Case 770-BFBGA, FCBGA
  • Speed 2GHz, 1GHz, 1GHz
  • RAM Size 2MB
  • Number of I/O 155
  • Operating Temperature -40°C ~ 125°C (TJ)
  • Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
  • Connectivity MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
  • Peripherals DMA, PWM, WDT
  • Supplier Device Package 770-FCBGA (23x23)
  • Architecture DSP, MCU, MPU
  • Grade Automotive
  • Qualification AEC-Q100
  • ECCN 5A992C
  • HTSUS 8542.31.0001
  • Moisture Sensitivity Level (MSL) 3 (168 Hours)
  • REACH Status REACH Unaffected
  • RoHS Status ROHS3 Compliant

Related Products


IC SOC CORTEX-M3 166MHZ 325BGA

In Stock: 1963

AUTOMOTIVE SYSTEM-ON-A-CHIP WITH

In Stock: 1749

IC SOC CORTEX-A9 667MHZ 400BGA

In Stock: 1838

Top