Technical Details

• Package / Case 30-WFBGA, FCBGA
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• On-State Resistance (Max) 5.8Ohm
• -3db Bandwidth 800MHz
• Supplier Device Package FlipChip 30
• Voltage - Supply, Single (V+) 1.65V ~ 4.3V
• Charge Injection 6.4pC
• Crosstalk -78dB @ 1MHz
• Switch Circuit DPDT
• Multiplexer/Demultiplexer Circuit 2:2
• Channel-to-Channel Matching (ΔRon) 300mOhm
• Switch Time (Ton, Toff) (Max) 15ns, 13ns
• Channel Capacitance (CS(off), CD(off)) 2pF
• Current - Leakage (IS(off)) (Max) 20nA
• Number of Circuits 4