技术参数

• Package / Case 88-VFQFN Exposed Pad, CSP
• Mounting Type Surface Mount
• Interface CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
• Type Blackfin+
• Operating Temperature -40°C ~ 85°C (TA)
• Non-Volatile Memory ROM (512kB)
• On-Chip RAM 128kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.10V
• Clock Rate 200MHz
• Supplier Device Package 88-LFCSP-VQ (12x12)
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant