技术参数

• Package / Case 88-VFQFN Exposed Pad, CSP
• Mounting Type Surface Mount
• Interface I2C, SPI
• Type Sigma
• Operating Temperature -40°C ~ 105°C (TA)
• Non-Volatile Memory ROM (96kB)
• On-Chip RAM 320kB
• Voltage - I/O 3.30V
• Voltage - Core 1.20V
• Clock Rate 294.912MHz
• Supplier Device Package 88-LFCSP (12x12)
• Grade Automotive
• ECCN 3A991A2
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant