| TYPE | DESCRIPTION |
| Mfr | Harimatec |
| Series | HF212 |
| Package | Bulk |
| Product Status | OBSOLETE |
| Composition | Sn96.5Ag3Cu0.5 (96.5/3/0.5) |
| Type | Solder Paste |
| Melting Point | 423°F (217°C) |
| Form | Jar, 17.64 oz (500g) |
| Process | Lead Free |
| Flux Type | No-Clean |
| Shelf Life Start | Date of Manufacture |
| Shelf Life | 6 Months |
