技术参数

• Package / Case 153-BGA
• Mounting Type Surface Mount
• Memory Size 512Gbit
• Memory Type Non-Volatile
• Operating Temperature -40°C ~ 85°C
• Technology FLASH - NAND (TLC)
• Memory Format FLASH
• Supplier Device Package 153-FBGA (11.5x13)
• Memory Interface eMMC_5.1
• Memory Organization 64G x 8
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH info available upon request
• RoHS Status ROHS3 Compliant