Inventory:1500

Technical Details

  • Package / Case 676-BBGA, FCBGA
  • Speed 800MHz
  • RAM Size 256KB
  • Number of I/O 130
  • Operating Temperature -40°C ~ 100°C (TJ)
  • Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
  • Primary Attributes Kintex™-7 FPGA, 125K Logic Cells
  • Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
  • Peripherals DMA
  • Supplier Device Package 676-FCBGA (27x27)
  • Architecture MCU, FPGA

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