Technical Details

• Package / Case 252-FBGA
• Mounting Type Surface Mount
• Speed 320MHz
• Program Memory Size 4MB (4M x 8)
• RAM Size 256K x 8
• Operating Temperature -40°C ~ 150°C (TJ)
• Oscillator Type External, Internal
• Program Memory Type FLASH
• EEPROM Size 64K x 8
• Core Processor RH850G3MH
• Data Converters A/D 48x12b SAR
• Core Size 32-Bit Tri-Core
• Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.5V
• Connectivity CANbus, CSI, LINbus, SCI, SPI
• Peripherals DMA, PWM, WDT
• Supplier Device Package 252-FBGA (17x17)
• Number of I/O 99