Technical Details

• Package / Case 609-BFBGA
• Mounting Type Surface Mount
• Speed 1.2GHz, 264MHz
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor ARM® Cortex®-A53, ARM® Cortex®-M4F
• Voltage - I/O 1.8V, 2.5V, 3.3V
• Supplier Device Package 609-FBGA (21x21)
• Ethernet 10/100/1000Mbps (2)
• USB USB 2.0 OTG + PHY (1), USB 3.0 OTG + PHY (1)
• Number of Cores/Bus Width 3 Core, 64-Bit
• Co-Processors/DSP Multimedia; NEON, Hi-Fi4 DSP
• RAM Controllers DDR3L SDRAM, LPDDR4 DRAM
• Graphics Acceleration Yes
• Display & Interface Controllers LCD, LVDS, MIPI-CSI, MIPI-DSI
• Security Features 3DES, A-HAB, ARM TZ, CAAM, DES, MD5, SHA, SNVS
• Additional Interfaces CANbus, I2C, MMC/SD/SDIO, PCIe, QSPI, UART