Inventory:1710

Technical Details

  • Package / Case 770-BFBGA, FCBGA
  • Speed 2GHz, 1GHz, 1GHz
  • RAM Size 1.5MB
  • Number of I/O 155
  • Operating Temperature -40°C ~ 125°C (TJ)
  • Core Processor ARM® Cortex®-A72, ARM® Cortex®-R5F, C66x, C7x
  • Connectivity MCAN, MMC/SD/SDIO, I2C, SPI, UART, USB
  • Peripherals DMA, PWM, WDT
  • Supplier Device Package 770-FCBGA (23x23)
  • Architecture DSP, MCU, MPU
  • Grade Automotive
  • Qualification AEC-Q100
Top