Technical Details

• Package / Case 10-UFBGA, FCBGA
• Mounting Type Surface Mount
• Operating Temperature -55°C ~ 125°C (TA)
• On-State Resistance (Max) 800mOhm
• -3db Bandwidth 9.5MHz
• Supplier Device Package 10-Microbump
• Voltage - Supply, Single (V+) 1.8V ~ 5.5V
• Charge Injection 15pC
• Crosstalk -83dB @ 100kHz
• Switch Circuit SPDT
• Multiplexer/Demultiplexer Circuit 2:1
• Channel-to-Channel Matching (ΔRon) 60mOhm
• Switch Time (Ton, Toff) (Max) 30ns, 30ns
• Channel Capacitance (CS(off), CD(off)) 102pF, 104pF
• Current - Leakage (IS(off)) (Max) 1µA
• Number of Circuits 2