技术参数

• Package / Case 256-BBGA
• Mounting Type Surface Mount
• Speed 135MHz
• Operating Temperature 0°C ~ 75°C (TA)
• Core Processor LynxEM
• Voltage - I/O 3.3V
• Supplier Device Package 256-BGA (27x27)
• Co-Processors/DSP Multimedia; RAMDAC
• RAM Controllers SGRAM
• Graphics Acceleration Yes
• Display & Interface Controllers DMA, LCD, LVDS
• Additional Interfaces I2C, SSP, PCI
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant