技术参数

• Package / Case 6-XFBGA, DSBGA
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• On-State Resistance (Max) 900mOhm
• -3db Bandwidth 100MHz
• Supplier Device Package 6-DSBGA (1.39x.89)
• Voltage - Supply, Single (V+) 1.65V ~ 5.5V
• Charge Injection -20pC
• Crosstalk -64dB @ 1MHz
• Switch Circuit SPDT
• Multiplexer/Demultiplexer Circuit 2:1
• Channel-to-Channel Matching (ΔRon) 50mOhm
• Switch Time (Ton, Toff) (Max) 30ns, 20ns
• Channel Capacitance (CS(off), CD(off)) 18pF
• Current - Leakage (IS(off)) (Max) 20nA
• Number of Circuits 1
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant