技术参数

• Connector Type B2B
• Size / Dimension 1.970" L x 1.570" W (50.00mm x 40.00mm)
• RAM Size 512MB
• Operating Temperature -40°C ~ 85°C
• Module/Board Type FPGA Core
• Core Processor Kintex UltraScale KU40
• Flash Size 32MB
• ECCN 3A991D
• HTSUS 8471.50.0150
• Moisture Sensitivity Level (MSL) 1 (Unlimited)