技术参数

• Connector Type Samtec UFPS
• Size / Dimension 2.050" L x 2.990" W (52.00mm x 76.00mm)
• RAM Size 1GB
• Operating Temperature -40°C ~ 85°C
• Module/Board Type MCU, FPGA
• Core Processor ARM® Cortex®-A9
• Co-Processor Zynq-7000 (Z-7045)
• Flash Size 32MB
• ECCN 3A991D
• HTSUS 8471.50.0150
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• RoHS Status ROHS3 Compliant