技术参数

• Connector Type 256-BGA
• Size / Dimension 0.830" L x 0.830" W (21.00mm x 21.00mm)
• Speed 1GHz
• RAM Size 512MB
• Operating Temperature -40°C ~ 85°C
• Module/Board Type MPU Core
• Core Processor ARM® Cortex®-A8, AM3358
• Co-Processor NEON™ SIMD
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant