技术参数

• Package / Case 400-LFBGA
• Mounting Type Surface Mount
• Speed 200MHz, 800MHz
• Operating Temperature -40°C ~ 105°C (TA)
• Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
• Voltage - I/O 1.8V, 2.5V, 2.8V, 3.15V
• Supplier Device Package 400-MAPBGA (17x17)
• Ethernet 10/100/1000Mbps (2)
• USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
• Number of Cores/Bus Width 2 Core, 32-Bit
• Co-Processors/DSP Multimedia; NEON™ MPE
• RAM Controllers LPDDR2, LVDDR3, DDR3
• Graphics Acceleration Yes
• Display & Interface Controllers Keypad, LCD
• Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
• Additional Interfaces AC'97, CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPDIF, SPI, SSI, UART
• ECCN 5A992C
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant