技术参数

• Features Break-Before-Make
• Package / Case 18-XFQFN Exposed Pad
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 85°C (TA)
• Applications MIPI
• On-State Resistance (Max) 8Ohm
• -3db Bandwidth 5GHz
• Supplier Device Package 18-TMLP (2x2.8)
• Voltage - Supply, Single (V+) 1.5V ~ 5V
• Switch Circuit SPDT
• Multiplexer/Demultiplexer Circuit 2:1
• Number of Channels 1
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant