技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Amplifier Type General Purpose
• Operating Temperature 0°C ~ 70°C (TA)
• Current - Supply 1.4mA (x4 Channels)
• Slew Rate 0.5V/µs
• Gain Bandwidth Product 1.2 MHz
• Current - Input Bias 20 nA
• Voltage - Input Offset 3 mV
• Supplier Device Package Wafer
• Number of Circuits 4
• Current - Output / Channel 30 mA
• Voltage - Supply Span (Min) 3 V
• Voltage - Supply Span (Max) 30 V
• ECCN EAR99
• HTSUS 8542.33.0001
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant