技术参数

• Package / Case 35-XFBGA, WLCSP
• Mounting Type Surface Mount
• Speed 48MHz
• Program Memory Size 64KB (64K x 8)
• RAM Size 8K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• Core Processor ARM® Cortex®-M0+
• Data Converters A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 1.71V ~ 5.5V
• Connectivity I2C, IrDA, LINbus, SPI, UART/USART
• Peripherals Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
• Supplier Device Package 35-WLCSP (2.11x2.6)
• Number of I/O 31
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant