技术参数

• Package / Case Die
• Mounting Type Surface Mount
• Interface Host Interface, Link Port, Serial Port
• Type Floating Point
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory External
• On-Chip RAM 256kB
• Voltage - I/O 3.30V
• Voltage - Core 3.30V
• Clock Rate 40MHz
• Supplier Device Package Die
• ECCN OBSOLETE
• HTSUS 0000.00.0000
• Moisture Sensitivity Level (MSL) 1 (Unlimited)