技术参数

• Package / Case 173-UFBGA, WLCSP
• Mounting Type Surface Mount
• Interface I2C, SLIMbus, SPI
• Type Audio Codec
• Operating Temperature -40°C ~ 85°C
• Voltage - I/O 1.8V, 2.0V, 2.5V, 2.7V, 3.0V, 3.3V
• Voltage - Core 1.20V
• Clock Rate 975 MIPS
• Supplier Device Package 173-WLCSP (5.81x4.65)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant