技术参数

• Package / Case 35-UFBGA, WLCSP
• Mounting Type Surface Mount
• Interface I2C, SPI, UART/USART, USB
• RAM Size 4K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Voltage - Supply 1.71V ~ 5.5V
• Program Memory Type FLASH (32KB)
• Applications USB Type C
• Core Processor ARM® Cortex®-M0
• Supplier Device Package 35-WLCSP (3.23x2.10)
• Number of I/O 31
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant