技术参数

• Package / Case 1089-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, DMA, I2C, MDIO, PCIe, TSIP, SPI, UART/USART, USB 3.0, USIM
• Type DSP+ARM®
• Operating Temperature -40°C ~ 100°C (TC)
• Non-Volatile Memory ROM (256kB)
• On-Chip RAM 2MB
• Voltage - I/O 1.35V, 1.5V, 1.8V, 3.3V
• Voltage - Core Variable
• Clock Rate 1.4GHz
• Supplier Device Package 1089-FCBGA (27x27)
• ECCN 5A002A1
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant