技术参数

• Package / Case 325-TFBGA, FCBGA
• Speed 166MHz
• RAM Size 64KB
• Number of I/O 180
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor ARM® Cortex®-M3
• Primary Attributes FPGA - 25K Logic Modules
• Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals DDR, PCIe, SERDES
• Supplier Device Package 325-FCBGA (11x11)
• Architecture MCU, FPGA
• Flash Size 256KB
• ECCN 3A991D
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant