技术参数

• Package / Case 337-LFBGA
• Mounting Type Surface Mount
• Interface ASP, I2C, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature 0°C ~ 85°C (TC)
• Non-Volatile Memory ROM (8kB)
• On-Chip RAM 56kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.30V
• Clock Rate 216MHz
• Supplier Device Package 337-BGA (13x13)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant