技术参数

• Package / Case 900-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM
• Type DSP+ARM®
• Operating Temperature -40°C ~ 100°C (TC)
• Non-Volatile Memory ROM (384kB)
• On-Chip RAM 5.384MB
• Voltage - I/O 0.85V, 1.0V, 1.8V, 3.3V
• Voltage - Core Variable
• Clock Rate 1GHz
• Supplier Device Package 900-FCBGA (25x25)
• ECCN 5A002A1 TI
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant