技术参数

• Package / Case 16-XFBGA, WLCSP
• Mounting Type Surface Mount
• Operating Temperature -40°C ~ 100°C (TJ)
• Voltage - Supply 1.14V ~ 1.26V
• Number of Logic Elements/Cells 1248
• Supplier Device Package 16-WLCSP (1.4x1.48)
• Number of LABs/CLBs 156
• Total RAM Bits 57344
• Number of I/O 10
• DigiKey Programmable Not Verified
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant