技术参数

• Package / Case 225-LFBGA, CSPBGA
• Speed 667MHz
• RAM Size 256KB
• Number of I/O 86
• Operating Temperature -40°C ~ 125°C (TJ)
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Primary Attributes Artix™-7 FPGA, 28K Logic Cells
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA
• Supplier Device Package 225-CSPBGA (13x13)
• Architecture MCU, FPGA
• Grade Automotive
• Qualification AEC-Q100
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant