技术参数

• Package / Case 30-WFBGA, CSPBGA
• Mounting Type Surface Mount
• Function Fully Integrated Processor
• Interface I2S
• Operating Temperature 0°C ~ 70°C (TA)
• Voltage - Supply 4.5V ~ 18V
• Specifications Full Flexible Amplification
• Applications Pre-Amplifier
• Supplier Device Package 30-CSP (3.24x2.57)
• Number of Channels 2
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant