技术参数

• Package / Case 196-LFBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, I2C, I2S, McBSP, McSPI, MMC/SD, SPI, UART/USART, UHPI, USB
• Type Fixed Point
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory ROM (128kB)
• On-Chip RAM 320kB
• Voltage - I/O 1.8V, 2.75V, 3.3V
• Voltage - Core 1.05V, 1.3V, 1.4V
• Clock Rate 200MHz
• Supplier Device Package 196-NFBGA (10x10)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant