技术参数

• Package / Case 8-WFDFN Exposed Pad, CSP
• Output Type Rail-to-Rail
• Mounting Type Surface Mount
• Amplifier Type CMOS
• Operating Temperature -40°C ~ 125°C
• Current - Supply 630µA (x2 Channels)
• Slew Rate 2V/µs
• Gain Bandwidth Product 4 MHz
• Current - Input Bias 0.5 pA
• Voltage - Input Offset 30 µV
• Supplier Device Package 8-LFCSP-WD (3x3)
• Number of Circuits 2
• Current - Output / Channel 40 mA
• -3db Bandwidth 2.1 MHz
• Voltage - Supply Span (Min) 3 V
• Voltage - Supply Span (Max) 18 V
• ECCN EAR99
• HTSUS 8542.33.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant