技术参数

• Package / Case 676-BGA
• Speed 166MHz
• RAM Size 64KB
• Number of I/O 425
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor ARM® Cortex®-M3
• Primary Attributes FPGA - 90K Logic Modules
• Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
• Peripherals DDR, PCIe, SERDES
• Supplier Device Package 676-FBGA (27x27)
• Architecture MCU, FPGA
• Flash Size 512KB
• ECCN 5A002A1
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant