技术参数

• Package / Case 896-BGA
• Speed 600MHz
• RAM Size 64KB
• Number of I/O MCU - 181, FPGA - 288
• Operating Temperature 0°C ~ 85°C (TJ)
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Primary Attributes FPGA - 110K Logic Elements
• Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA, POR, WDT
• Supplier Device Package 896-FBGA (31x31)
• Architecture MCU, FPGA
• ECCN 3A001A2C
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected