技术参数

• Package / Case 1517-BBGA, FCBGA
• Speed 1.05GHz
• RAM Size 64KB
• Number of I/O MCU - 208, FPGA - 540
• Operating Temperature -40°C ~ 100°C (TJ)
• Core Processor Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
• Primary Attributes FPGA - 462K Logic Elements
• Connectivity EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
• Peripherals DMA, POR, WDT
• Supplier Device Package 1517-FBGA, FC (40x40)
• Architecture MCU, FPGA
• ECCN 3A001A2C
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected