技术参数

• Package / Case Die
• Output Type Rail-to-Rail
• Mounting Type Surface Mount
• Amplifier Type CMOS
• Voltage - Input Offset 500 µV
• Supplier Device Package Die
• Number of Circuits 4
• Voltage - Supply Span (Min) 2.5 V
• Voltage - Supply Span (Max) 2.5 V
• ECCN EAR99
• HTSUS 8542.33.0001
• Moisture Sensitivity Level (MSL) Not Applicable
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant