技术参数

• Package / Case 860-BGA Exposed Pad
• Mounting Type Surface Mount
• Number of Gates 2541952
• Operating Temperature -40°C ~ 100°C (TJ)
• Voltage - Supply 1.71V ~ 1.89V
• Number of Logic Elements/Cells 43200
• Supplier Device Package 860-FBGA (42.5x42.5)
• Number of LABs/CLBs 9600
• Total RAM Bits 655360
• Number of I/O 660
• DigiKey Programmable Not Verified
• ECCN 3A001A7A
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status RoHS non-compliant