技术参数

• Package / Case 100-TFBGA
• Mounting Type Surface Mount
• Speed 180MHz
• Program Memory Size 768KB (768K x 8)
• RAM Size 136K x 8
• Operating Temperature -40°C ~ 105°C (TA)
• Oscillator Type Internal
• Program Memory Type FLASH
• EEPROM Size 16K x 8
• Core Processor ARM® Cortex®-M3
• Data Converters A/D 4x10b; D/A 1x10b
• Core Size 32-Bit Single-Core
• Voltage - Supply (Vcc/Vdd) 2.2V ~ 3.6V
• Connectivity CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART
• Peripherals Brown-out Detect/Reset, DMA, I2S, POR, WDT
• Supplier Device Package 100-TFBGA (9x9)
• Number of I/O 49
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant