技术参数

• Package / Case 1031-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, I2C, McASP, McBSP, PCI, Serial ATA, SD/SDIO, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature 0°C ~ 95°C (TJ)
• Non-Volatile Memory ROM (48kB)
• On-Chip RAM 1.5MB
• Voltage - I/O 1.5V, 1.8V, 3.3V
• Voltage - Core 1.00V
• Clock Rate 1.125GHz DSP, 1.35GHz ARM®
• Supplier Device Package 1031-FCBGA (25x25)
• ECCN 5A002A1 TI
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant