技术参数

• Package / Case 529-BFBGA, FCBGA
• Mounting Type Surface Mount
• Interface EBI/EMI, Ethernet, HPI, I2C, McASP, PCI, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature -40°C ~ 85°C (TC)
• Non-Volatile Memory ROM (8kB)
• On-Chip RAM 248kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.30V
• Clock Rate 1GHz DSP, 500MHz ARM®
• Supplier Device Package 529-FCBGA (19x19)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 4 (72 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant