技术参数

• Package / Case 676-BGA
• Mounting Type Surface Mount
• Function TDM-over-Packet (TDMoP)
• Interface TDMoP
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 1.8V, 3.3V
• Supplier Device Package 676-TEPBGA (27x27)
• Number of Circuits 1
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant