技术参数

• Package / Case 208-BGA
• Mounting Type Surface Mount
• Speed 50MHz
• Program Memory Size 1MB (1M x 8)
• RAM Size 64K x 8
• Operating Temperature -40°C ~ 85°C (TA)
• Oscillator Type External
• Program Memory Type FLASH
• EEPROM Size 4K x 8
• Core Processor HCS12X
• Data Converters A/D 32x12b
• Core Size 16-Bit
• Voltage - Supply (Vcc/Vdd) 1.72V ~ 5.5V
• Connectivity CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
• Peripherals LVD, POR, PWM, WDT
• Supplier Device Package 208-BGA (17x17)
• Number of I/O 152
• DigiKey Programmable Not Verified
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant