技术参数

• Package / Case 16-SOIC (0.154", 3.90mm Width)
• Delay Time 4.0ns
• Number of Channels 1 x 2:2
• Mounting Type Surface Mount
• Output LVDS
• Type Buffer, Multiplexer
• Input LVDS
• Operating Temperature -40°C ~ 85°C
• Voltage - Supply 3V ~ 3.6V
• Applications LVDS
• Current - Supply 21mA
• Data Rate (Max) 250Mbps
• Supplier Device Package 16-SOIC
• Capacitance - Input 3 pF
• ECCN EAR99
• HTSUS 8542.39.0001
• Moisture Sensitivity Level (MSL) 1 (Unlimited)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant