技术参数

• Package / Case 361-LFBGA
• Mounting Type Surface Mount
• Interface ASP, EBI/EMI, Host Interface, I2C, SPI, UART, USB
• Type Digital Media System-on-Chip (DMSoC)
• Operating Temperature 0°C ~ 85°C (TC)
• Non-Volatile Memory ROM (8kB)
• On-Chip RAM 160kB
• Voltage - I/O 1.8V, 3.3V
• Voltage - Core 1.30V
• Clock Rate 810MHz DSP, 405MHz ARM®
• Supplier Device Package 361-NFBGA (16x16)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant