技术参数

• Package / Case 256-BGA
• Mounting Type Surface Mount
• Interface CAN, EBI/EMI, I2C, McBSP, SCI, SPI
• Type Floating Point
• Operating Temperature -40°C ~ 105°C (TJ)
• Non-Volatile Memory ROM (16kB)
• On-Chip RAM 516kB
• Voltage - I/O 3.30V
• Voltage - Core 1.20V
• Clock Rate 300MHz
• Supplier Device Package 256-BGA (17x17)
• ECCN 3A991A2
• HTSUS 8542.31.0001
• Moisture Sensitivity Level (MSL) 3 (168 Hours)
• REACH Status REACH Unaffected
• RoHS Status ROHS3 Compliant