技术参数

• Connector Type Board-to-Board (BTB) Socket - 250
• Size / Dimension 2.990" L x 2.050" W (76.00mm x 52.00mm)
• RAM Size 1GB
• Operating Temperature -40°C ~ 85°C
• Module/Board Type MPU Core
• Core Processor ARM Cortex-A9
• Co-Processor Xilinx Zynq 7035 SoC XC7Z035-2FBG676I
• Flash Size 64MB
• Moisture Sensitivity Level (MSL) Not Applicable
• RoHS Status ROHS3 Compliant